Lapping Machine #3
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#1 Chip Decapping
fafo/techtree
#2 Chip Delayering
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Reference: fafo/techtree#3
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⇒ Wikipedia
For us, a lapping machine is mainly useful for precisely grinding away the surface of an IC package or even layers of the die itself.
Ideally we can find one for cheap second-hand.
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Digest: 59f5f086bc352a69aa1336ddda860c49618e39a499245165d983228cb0b412a8; Last Updated: 2025-05-25 15:31:08