Chip Decapping #1
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#2 Chip Delayering
fafo/techtree
#16 Laser Fault Injection
fafo/techtree
#20 Body Bias Injection
fafo/techtree
#36 Primitive Chip Imaging
fafo/techtree
#3 Lapping Machine
fafo/techtree
#6 HNO₃/H₂SO₄ Etching
fafo/techtree
#7 Laser Cutting
fafo/techtree
#8 Plasma Etching
fafo/techtree
Reference: fafo/techtree#1
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Digest: ee1f7fd5e9721d9be04c16102288017bb3aa3476c3524614b699e10a4f3d4ed7; Last Updated: 2025-08-20 20:57:52
@q3k, can you edit the issue body and add some documentation on the various choices we have for doing this (#3, #6, #7, #8) and a rough outline what the advantages/disadvantages for us would be?