Full Chip Reverse Engineering #13

New issue

Open

opened 2025-05-22 20:06:02 +00:00 by rahix · 1 comment

rahix commented

2025-05-22 20:06:02 +00:00

Owner

The ability to fully reverse engineer the inner working of a chip.

ID Iephiot7yiek

The ability to fully reverse engineer the inner working of a chip. ID Iephiot7yiek

rahix added the

Type

Process

label 2025-05-22 20:06:02 +00:00

rahix added a new dependency 2025-05-22 20:06:10 +00:00

#12 DASH Stain

rahix added a new dependency 2025-05-22 20:06:17 +00:00

#11 Simple Chip Imaging

forgejo-actions commented

2025-05-22 20:06:20 +00:00

Partial Techtree

flowchart BT

    classDef eoi fill:#fff, stroke:#000, color:#000;
    classDef dependant fill:#fff, stroke:#888, color:#888;
    classDef dep_missing fill:#fcc, stroke:#800, color:#000;
    classDef dep_assigned fill:#ffa, stroke:#a50, color:#000;
    classDef dep_completed fill:#afa, stroke:#080, color:#000;
    0:::eoi
    0["#13 | MISSING<br/><i>Process</i><br/><b>Full Chip Reverse Engineering</b>"]
    1:::dep_assigned
    1["#78 | ASSIGNED<br/><i>Process</i><br/><b>Optical Die Imaging</b>"]
    2:::dep_assigned
    2["#9 | ASSIGNED<br/><i>Development</i><br/><b>Optical Microscope: Motorized Stage</b>"]
    3:::dep_assigned
    3["#63 | ASSIGNED<br/><i>Equipment</i><br/><b>OpenFlexure Delta Stage</b>"]
    4:::dep_completed
    4["#64 | COMPLETED<br/><i>Equipment</i><br/><b>FFF 3D-Printer</b>"]
    5:::dep_assigned
    5["#14 | ASSIGNED<br/><i>Equipment</i><br/><b>Optical Microscope</b>"]
    6:::dep_missing
    6["#12 | MISSING<br/><i>Process</i><br/><b>DASH Stain</b>"]
    7:::dep_assigned
    7["#4 | ASSIGNED<br/><i>Equipment</i><br/><b>Wet Lab (Chemistry)</b>"]
    8:::dep_assigned
    8["#68 | ASSIGNED<br/><i>Equipment</i><br/><b>Heating Stirrer</b>"]
    9:::dep_assigned
    9["#67 | ASSIGNED<br/><i>Equipment</i><br/><b>Chemical Storage/Containment</b>"]
    10:::dep_assigned
    10["#27 | ASSIGNED<br/><i>Equipment</i><br/><b>Technical Ventilation</b>"]
    11:::dep_assigned
    11["#23 | ASSIGNED<br/><i>Equipment</i><br/><b>Fume Hood</b>"]
    12:::dep_missing
    12["#11 | MISSING<br/><i>Process</i><br/><b>Simple Chip Imaging</b>"]
    13:::dep_missing
    13["#36 | MISSING<br/><i>Process</i><br/><b>Primitive Chip Imaging</b>"]
    14:::dep_completed
    14["#41 | COMPLETED<br/><i>Process</i><br/><b>Primitive Die Imaging</b>"]
    15:::dep_completed
    15["#29 | COMPLETED<br/><i>Process</i><br/><b>SEM Imaging@10µm</b>"]
    16:::dep_completed
    16["#28 | COMPLETED<br/><i>Equipment</i><br/><b>Scanning Electron Microscope (SEM)</b>"]
    17:::dep_completed
    17["#26 | COMPLETED<br/><i>Equipment</i><br/><b>Water Cooling</b>"]
    18:::dep_missing
    18["#1 | MISSING<br/><i>Process</i><br/><b>Chip Decapping</b>"]
    19:::dep_missing
    19["#8 | MISSING<br/><i>Process</i><br/><b>Plasma Etching</b>"]
    20:::dep_missing
    20["#25 | MISSING<br/><i>Equipment</i><br/><b>Plasma Etcher</b>"]
    21:::dep_completed
    21["#24 | COMPLETED<br/><i>Equipment</i><br/><b>~3ph Power (below 10kW)</b>"]
    22:::dep_missing
    22["#7 | MISSING<br/><i>Process</i><br/><b>Laser Cutting</b>"]
    23:::dep_missing
    23["#6 | MISSING<br/><i>Process</i><br/><b>HNO₃/H₂SO₄ Decapping</b>"]
    24:::dep_missing
    24["#3 | MISSING<br/><i>Equipment</i><br/><b>Lapping Machine</b>"]
    25:::dep_completed
    25["#31 | COMPLETED<br/><i>Process</i><br/><b>SEM Imaging@100nm</b>"]
    26:::dep_completed
    26["#30 | COMPLETED<br/><i>Process</i><br/><b>SEM Imaging@1µm</b>"]
    27:::dep_assigned
    27["#10 | ASSIGNED<br/><i>Equipment</i><br/><b>SEM: Motorized Stage</b>"]
    28:::dep_missing
    28["#2 | MISSING<br/><i>Process</i><br/><b>Chip Delayering</b>"]
    29:::dep_missing
    29["#21 | MISSING<br/><i>Process</i><br/><b>Reactive Ion Etching</b>"]
    30:::dep_missing
    30["#5 | MISSING<br/><i>Process</i><br/><b>BOE Etching of SiO₂</b>"]
    31:::dependant
    31["#114 | MISSING<br/><i>Process</i><br/><b>Semiconductor & Electronics Analysis</b>"]
    1 --> 2
    9 --> 10
    3 --> 4
    14 --> 15
    13 --> 18
    13 --> 14
    25 --> 26
    26 --> 15
    15 --> 16
    16 --> 17
    20 --> 21
    20 --> 10
    11 --> 10
    29 --> 20
    0 --> 12
    0 --> 6
    0 --> 1
    6 --> 7
    12 --> 28
    12 --> 27
    12 --> 25
    12 --> 13
    27 --> 16
    2 --> 5
    2 --> 3
    19 --> 20
    23 --> 7
    30 --> 7
    7 --> 11
    7 --> 10
    7 --> 9
    7 --> 8
    28 --> 18
    28 --> 24
    28 --> 30
    28 --> 22
    28 --> 29
    18 --> 24
    18 --> 23
    18 --> 22
    18 --> 19
    31 --> 0

Digest: a57de2a89f4c3e9e8b55efdf56c0173ee01bbbdbc0fb4e5fdfd7810736656d5c; Last Updated: 2025-11-09 09:56:40

## Partial Techtree ```mermaid flowchart BT classDef eoi fill:#fff, stroke:#000, color:#000; classDef dependant fill:#fff, stroke:#888, color:#888; classDef dep_missing fill:#fcc, stroke:#800, color:#000; classDef dep_assigned fill:#ffa, stroke:#a50, color:#000; classDef dep_completed fill:#afa, stroke:#080, color:#000; 0:::eoi 0["#13 | MISSING Process Full Chip Reverse Engineering"] 1:::dep_assigned 1["#78 | ASSIGNED Process Optical Die Imaging"] 2:::dep_assigned 2["#9 | ASSIGNED Development Optical Microscope: Motorized Stage"] 3:::dep_assigned 3["#63 | ASSIGNED Equipment OpenFlexure Delta Stage"] 4:::dep_completed 4["#64 | COMPLETED Equipment FFF 3D-Printer"] 5:::dep_assigned 5["#14 | ASSIGNED Equipment Optical Microscope"] 6:::dep_missing 6["#12 | MISSING Process DASH Stain"] 7:::dep_assigned 7["#4 | ASSIGNED Equipment Wet Lab (Chemistry)"] 8:::dep_assigned 8["#68 | ASSIGNED Equipment Heating Stirrer"] 9:::dep_assigned 9["#67 | ASSIGNED Equipment Chemical Storage/Containment"] 10:::dep_assigned 10["#27 | ASSIGNED Equipment Technical Ventilation"] 11:::dep_assigned 11["#23 | ASSIGNED Equipment Fume Hood"] 12:::dep_missing 12["#11 | MISSING Process Simple Chip Imaging"] 13:::dep_missing 13["#36 | MISSING Process Primitive Chip Imaging"] 14:::dep_completed 14["#41 | COMPLETED Process Primitive Die Imaging"] 15:::dep_completed 15["#29 | COMPLETED Process SEM Imaging@10µm"] 16:::dep_completed 16["#28 | COMPLETED Equipment Scanning Electron Microscope (SEM)"] 17:::dep_completed 17["#26 | COMPLETED Equipment Water Cooling"] 18:::dep_missing 18["#1 | MISSING Process Chip Decapping"] 19:::dep_missing 19["#8 | MISSING Process Plasma Etching"] 20:::dep_missing 20["#25 | MISSING Equipment Plasma Etcher"] 21:::dep_completed 21["#24 | COMPLETED Equipment ~3ph Power (below 10kW)"] 22:::dep_missing 22["#7 | MISSING Process Laser Cutting"] 23:::dep_missing 23["#6 | MISSING Process HNO₃/H₂SO₄ Decapping"] 24:::dep_missing 24["#3 | MISSING Equipment Lapping Machine"] 25:::dep_completed 25["#31 | COMPLETED Process SEM Imaging@100nm"] 26:::dep_completed 26["#30 | COMPLETED Process SEM Imaging@1µm"] 27:::dep_assigned 27["#10 | ASSIGNED Equipment SEM: Motorized Stage"] 28:::dep_missing 28["#2 | MISSING Process Chip Delayering"] 29:::dep_missing 29["#21 | MISSING Process Reactive Ion Etching"] 30:::dep_missing 30["#5 | MISSING Process BOE Etching of SiO₂"] 31:::dependant 31["#114 | MISSING Process Semiconductor & Electronics Analysis"] 1 --> 2 9 --> 10 3 --> 4 14 --> 15 13 --> 18 13 --> 14 25 --> 26 26 --> 15 15 --> 16 16 --> 17 20 --> 21 20 --> 10 11 --> 10 29 --> 20 0 --> 12 0 --> 6 0 --> 1 6 --> 7 12 --> 28 12 --> 27 12 --> 25 12 --> 13 27 --> 16 2 --> 5 2 --> 3 19 --> 20 23 --> 7 30 --> 7 7 --> 11 7 --> 10 7 --> 9 7 --> 8 28 --> 18 28 --> 24 28 --> 30 28 --> 22 28 --> 29 18 --> 24 18 --> 23 18 --> 22 18 --> 19 31 --> 0 ``` Digest: a57de2a89f4c3e9e8b55efdf56c0173ee01bbbdbc0fb4e5fdfd7810736656d5c; Last Updated: 2025-11-09 09:56:40

rahix added the

Needs Documentation

label 2025-05-22 20:09:37 +00:00

rahix added a new dependency 2025-11-09 00:53:38 +00:00

#78 Optical Die Imaging

rahix added a new dependency 2025-11-09 09:56:11 +00:00

#114 Semiconductor & Electronics Analysis